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NTB5605P, NTBV5605
Power MOSFET
-60 V, -18.5 A
P ? Channel, D 2 PAK
Features
? Designed for Low R DS(on)
? Withstands High Energy in Avalanche and Commutation Modes
? AEC Q101 Qualified ? NTBV5605
? These Devices are Pb ? Free and are RoHS Compliant
Applications
? Power Supplies
? PWM Motor Control
? Converters
? Power Management
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
V (BR)DSS
? 60 V
G
http://onsemi.com
R DS(on) TYP
120 m W @ ? 5.0 V
P ? Channel
D
S
I D MAX
? 18.5 A
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
? 60
Unit
V
MARKING DIAGRAM
& PIN ASSIGNMENT
Gate ? to ? Source Voltage
Continuous Drain Steady T A = 25 ° C
Current (Note 1) State
Power Dissipation Steady T A = 25 ° C
(Note 1) State
Pulsed Drain Current t p = 10 m s
Operating Junction and Storage Temperature
Single Pulse Drain ? to ? Source Avalanche
Energy (V DD = 25 V, V GS = 5.0 V, I PK = 15 A,
L = 3.0 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8 in from case for 10 s)
THERMAL RESISTANCE RATINGS
V GS
I D
P D
I DM
T J ,
T STG
E AS
T L
$ 20
? 18.5
88
? 55
? 55 to
175
338
260
V
A
W
A
° C
mJ
° C
1
2
3
D 2 PAK
CASE 418B
STYLE 2
x
A
Y
WW
G
4
4
Drain
NTB5605xG
AYWW
1 2 3
Gate Drain Source
= P or blank
= Assembly Location
= Year
= Work Week
= Pb ? Free Package
Parameter
Symbol
Max
Unit
ORDERING INFORMATION
Junction ? to ? Case (Drain) – Steady State
R q JC
1.7
° C/W
Device
Package
Shipping ?
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 1 ″ pad size (Cu Area 1.127 in 2 ).
2. When surface mounted to an FR4 board using the minimum recommended
pad size (Cu Area 0.41 in 2 ).
NTB5605PT4G D 2 PAK 800 / Tape & Reel
(Pb ? Free)
NTBV5605T4G D 2 PAK 800 / Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2011
August, 2011 ? Rev. 4
1
Publication Order Number:
NTB5605P/D
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